期刊论文

Mou, Yun(mouluck@163.com)

英文

Energy Conversion and Management

0196-8904

2021

243

114329

10.1016/j.enconman.2021.114329

In this work, the integration module of chips-on-TEG was proposed to recover the waste heat from high-power lighting. The chips-on-TEG has a direct chip bonding structure, which enhances the heat transfer from the chips to the hot side ceramic of TEG. When the chip current increases from 0.4 to 1.4 A, the heat power from the chips increases from 1.7 to 9.2 W. The TEG displays a high temperature gradient of 219 °C at the chip current of 1.4 A, which is a enough waste heat energy. The waste heat

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A waste heat is inevitably generated in high-power lighting due to the limited efficiency of light-emitting diode (LED) chips and the non-radiative transition of phosphors. In this work, we proposed an integrated module of LED chips on thermoelectric generator (TEG) for the waste heat recycling of high-power lighting. The multi-chips were directly bonded on the hot side of TEG for heat conduction. The chip powers and temperature distribution of chips-on-TEG were investigated under different chip currents, and their output voltage, current, and ...