期刊论文

Preparation and Application of copper ion imprinted modified chitosan sponge

中文

武汉轻工大学学报

2095-7386

2014

3

39-41

10.3969/j.issn.2095-7386.2014.03.011

本校为第一机构

以醋酸铜为模板,甲醇、氯仿为溶剂,2-乙烯吡啶、丙烯酰胺为功能单体,乙二醇二甲基丙烯酸酯为交联剂,采用本体聚合法制备铜离子印迹聚合物;然后掺入到壳聚糖海绵的制备中,使壳聚糖海绵对铜离子的吸附率由27.1%提高到72.3%。制备的铜离子印迹改性壳聚糖海绵需要2 d达到吸附平衡,吸附—解吸5次后,性能稳定。

using copper acetate as a template and methanol , chloroform as solvent , 2-vinylpyridine , acrylamide as functional monomer, ethylene glycol dimethacrylate as a crosslinking agent , a copper ion imprinted polymer (IIP) was prepared with bulk polymerization .Then the IIP was incorporated into the preparation of chitosan sponge , the adsorption rate of chitosan sponge in copper ion aqueous solution was developed from 27 .1%to 72 .3%.The IIP modified chitosan sponge reached equilibrium for 2 d .Results showed that stable ...