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Analysis on the Thermal Fatigue Behavior of Single SnAgCu Solder Joint

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成果类型:
会议论文
作者:
Chen, Jibing*;Xie, Yu;He, Zhanwen;Wan, Nong;Wu, Yiping
通讯作者:
Chen, Jibing
作者机构:
[Xie, Yu; He, Zhanwen; Wan, Nong; Chen, Jibing] Wuhan Polytech Univ, Sch Mech Engn, Wuhan, Peoples R China.
[Wu, Yiping] Huazhong Univ Sci & Technol, Wuhan Natl Lab Optoelect, Ctr Connecting & Elect Packaging, Wuhan, Peoples R China.
通讯机构:
[Chen, Jibing] W
Wuhan Polytech Univ, Sch Mech Engn, Wuhan, Peoples R China.
语种:
英文
关键词:
thermal fatigue behavior;intermetallic compound;SAC305 Solder Joint;microstructure
期刊:
ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY
年:
2019
会议名称:
20th International Conference on Electronic Packaging Technology (ICEPT)
会议时间:
AUG 12-15, 2019
会议地点:
Hong Kong, HONG KONG
会议主办单位:
[Chen, Jibing;Xie, Yu;He, Zhanwen;Wan, Nong] Wuhan Polytech Univ, Sch Mech Engn, Wuhan, Peoples R China.^[Wu, Yiping] Huazhong Univ Sci & Technol, Wuhan Natl Lab Optoelect, Ctr Connecting & Elect Packaging, Wuhan, Peoples R China.
会议赞助商:
IMECAS, HKSTP, IEEE Elect Packaging Soc, EMPT
出版地:
345 E 47TH ST, NEW YORK, NY 10017 USA
出版者:
IEEE
ISBN:
978-1-7281-5064-2
基金类别:
Scientific Research Projects of Hubei Provincial Department of Education
机构署名:
本校为第一且通讯机构
院系归属:
机械工程学院
摘要:
To verify whether the results of rapid thermal fatigue of solder joint are consistent with that of the conventional fatigue method, the repeated thermal cycling condition of alternating temperature should be created. In this paper, an experiment, which heat rapidly a metal boss under the single solder joint in 10 seconds by the induced eddy current effect of electromagnetic field and then stop to heat it at the same time in sequence, was implemented. That is to say, the single solder joint above the boss was heated and cooled through heat conduction of the boss where the heat quantity is gener...

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