Lead-free solder has been widely used in electronic packaging products in printed circuit boards (PCB). Because soldering in the microelectronics industry not only provides the electronic connection, but also ensures the mechanical reliability of solder joints under the complex service conditions. This study provides some prospective into the microstructural changes of the solder joints interconnection by rapid thermal cycles. The goal of this paper is to investigate the thermal fatigue behavior of a single Sn-3.0Ag-0.5Cu (SAC) lead-free solder joint treated by rapidly alternating heating and ...
