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Active Thermal Management of High-Power LED through Chip on Thermoelectric Cooler

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成果类型:
期刊论文
作者:
Li, Shuang;Liu, Jinglong;Ding, Lu;Liu, Jiaxin;Xu, Jian;...
通讯作者:
Chen, M.;Peng, Y.
作者机构:
[Liu, Jiaxin; Chen, Mingxiang; Li, Shuang; Liu, Jinglong] Huazhong Univ Sci & Technol, Sch Mech Sci & Engn, Wuhan 430074, Peoples R China.
[Xu, Jian; Ding, Lu] Wuhan Polytech Univ, Sch Elect & Elect Engn, Wuhan 430023, Peoples R China.
[Peng, Yang] Huazhong Univ Sci & Technol, Sch Aerosp Engn, Wuhan 430074, Peoples R China.
通讯机构:
[Chen, M.; Peng, Y.] S
School of Mechanical Science and Engineering, China
School of Aerospace Engineering, China
语种:
英文
关键词:
Light emitting diodes;Heating systems;Substrates;Cooling;Packaging;Thermal management;Heat sinks;Chip on thermoelectric cooler (chip-on-TEC);high-power light-emitting diode (LED);light output power;working temperature
期刊:
IEEE Transactions On Electron Devices
ISSN:
0018-9383
年:
2021
卷:
68
期:
4
页码:
1753-1756
基金类别:
Manuscript received January 18, 2021; revised February 22, 2021; accepted February 22, 2021. Date of publication March 10, 2021; date of current version March 24, 2021. This work was supported in part by the National Natural Science Foundation of China under Grant 51805196 and Grant 51775219 and in part by the Fundamental Research Funds for the Central Universities under Grant 2020kfyXJJS092. The review of this article was arranged by Editor C. Bayram. (Corresponding authors: Yang Peng; Mingxiang Chen.) Shuang Li, Jinglong Liu, Jiaxin Liu, and Mingxiang Chen are with the School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China (e-mail: chimish@hust.edu.cn).
机构署名:
本校为其他机构
院系归属:
电气与电子工程学院
摘要:
In this work, we proposed a chip on thermoelectric cooler (chip-on-TEC) for the active thermal management of high-power light-emitting diode (LED). The chip-on-TEC was prepared by electroplating a circuit layer on the cold-side substrate of thermoelectric cooling (TEC) and directly attaching LED chips on the circuit layer. Due to the Peltier effect of TE materials and the low thermal resistance of chip-on-TEC structure, the heat generated from the chips can be dissipated to the surrounding environment effectively. The performances of chip-on-TEC were studied by using the thermal simulation and...

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