期刊论文

High-temperature microsystem packaging technology and high-temperature reliability

中文

中国科学：信息科学

1674-7267

2023

53

04

803-814

2020BAB068:湖北省重点研发计划资助项目 2021BAA071:湖北省重点研发计划资助项目

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针对武器装备、航空航天等领域高温封装需求,提出一种耐高温微系统气密封装技术.选用氮化铝直接电镀陶瓷基板(direct plated ceramic substrate, DPC)作为封装散热基板,可伐(Kovar)合金作...展开更多 针对武器装备、航空航天等领域高温封装需求,提出一种耐高温微系统气密封装技术.选用氮化铝直接电镀陶瓷基板(direct plated ceramic substrate, DPC)作为封装散热基板,可伐(Kovar)合金作为封装盖板,金锡合金(Au80Sn20)作为焊接材料实现气密封装,并通过有限元模拟优化了最小焊接应力下的焊环厚度.根据设计方案制备了集成热敏电阻和微型加速度计的微系统器件.测试结果表明,微系统封装样品焊接质量良...

To meet the requirements of high-temperature microsystem packaging in weapons,aerospace,and other fields,a high-temperature-resistant microsystem hermetic packaging technology is proposed.A direct plated ceramic substrate(DPC)made of aluminum nitride was used as the hea...MORE To meet the requirements of high-temperature microsystem packaging in weapons,aerospace,and other fields,a high-temperature-resistant microsystem hermetic packaging technology is proposed.A direct plated ceramic substrate(DPC)made of aluminum nitride was used as the heat ...