PurposeThe purpose of this study is to investigate the reliability of flex-on-board (FOB) interconnection connected with an anisotropic conductive paste (ACP), which is prepared by dispersing nickel balls in the epoxy-curing system. Design/methodology/approachDifferential scanning calorimetry was used to evaluate the curing characteristics of the paste. And the contact resistances of bonding joints and 90o peel adhesion were tested before and after high temperature and high humidity test (85 degrees C, 85% humidity), thermal cycling (-45 degrees C similar to 125 degrees C, 30min/cycle) and pre...
