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Effects of Polymer Conductive Particle Contents on the Electrical Performance and Reliability of 50- μm Pitch Flex-on-Flex Assemblies Using Anisotropic Conductive Films

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成果类型:
期刊论文
作者:
Pan, Yan;Song, Lu;Zhang, Shuye;Cai, Xionghui;Paik, Kyung-Wook*
通讯作者:
Paik, Kyung-Wook
作者机构:
[Zhang, Shuye; Pan, Yan] Korea Adv Inst Sci & Technol, Nano Packaging & Interconnect Lab, Dept Mat Sci & Engn, Daejeon 305701, South Korea.
[Paik, Kyung-Wook; Cai, Xionghui; Song, Lu] Wuhan Polytech Univ, Dept Chem & Environm Engn, Wuhan 430023, Hubei, Peoples R China.
通讯机构:
[Paik, Kyung-Wook] W
Wuhan Polytech Univ, Dept Chem & Environm Engn, Wuhan 430023, Hubei, Peoples R China.
语种:
英文
关键词:
50 mu m pitch flex-on-flex (FOF);anisotropic conductive films (ACFs);thermal cycling (T/C) reliability test
期刊:
IEEE Transactions on Components Packaging and Manufacturing Technology
ISSN:
2156-3950
年:
2017
卷:
7
期:
11
页码:
1759-1764
机构署名:
本校为通讯机构
院系归属:
化学与环境工程学院
摘要:
Anisotropic conductive films (ACFs) composed of an adhesive polymer resin and fine conductive particles such as metal-coated polymer conductive particles are interconnect materials for fine-pitch flex-on-flex (FOF) assembly technologies due to their fine-pitch handling capability, low-temperature bonding, and stable electrical properties due to the compliance of polymer conductive particles. For the ultrafine pitch FOF assembly, the polymer conductive particle content becomes more important due to electrical storage problem between electrodes. ...

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