期刊论文

Hui Li

英文

Microelectronics Reliability

0026-2714

2022

139

114829

10.1016/j.microrel.2022.114829

Conceptualization: Yunfan Zhang, Hui Li. Methodology: Yunfan Zhang, Hui Li, Shengnan Shen. Resources: Hui Li, Wan Cao. Experiment: Kangkang Wu, Yunfan Zhang, Feng Li, Jinzhe Han. Supervision: Hui Li. Validation: Kangkang Wu, Feng Li, Jinzhe Han. Roles/Writing - original draft: Kangkang Wu, Hui Li, Yunfan Zhang. Writing - review & editing: Yunfan Zhang, Hui Li. Yunfan Zhang and Kangkang Wu contributed equally to this work.

本校为其他机构

Thermal fatigue is one of the main causes of device failure in micro-electro-mechanical systems (MEMS). Gold wire bonding plays the role of electrical connection and signal transmission, which is the key structure of MEMS pressure sensor. In this paper, the fatigue failure of gold wire bonding solder joints caused by the thermal cycling test was studied. The thermal cycling test on MEMS pressure sensor was conducted using a temperature chamber with the cycling temperature range from -40 degrees C to 150 degrees C. After 1600 cycles, the solder joints were found with significant resistance incr...