会议论文

Chen, Jibing

英文

2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT)

2017

301-304

18th International Conference on Electronic Packaging Technology (ICEPT)

2017 18th International Conference on Electronic Packaging Technology (ICEPT)

AUG 16-19, 2017

IEEE, Harbin, PEOPLES R CHINA

IEEE

IMECAS, CPMT, EMPT, HIT

345 E 47TH ST, NEW YORK, NY 10017 USA

IEEE

978-1-5386-2972-7

10.1109/ICEPT.2017.8046459

Scientific and Technological Research Projects of Hubei Province [B2016079]

本校为第一且通讯机构

BGA micro-joint with double substrates used by SAC305 lead-free solder is fabricated by reflowing process based on substrate FR-4. The microstructures of the solder joints are studied through the method of rapid thermal cycling (RPC). The double-based plate Cu/SAC305/Cu solder joint was tested at extreme temperature 60-180 degrees C by rapid thermal cycling 48 hours and 72 hours respectively, it was found the IMC grow by the zigzag shape, and fatigue cracks greatly appear at the interface of IMC/Cu, they are initiating and propagating along the boundary, and thread through the cross section of...