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Substrate temperature compensation for microbolometric focal plane array without TEC

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成果类型:
期刊论文
作者:
Chen, Xiqu*;Fang, Chao;Lv, Qiang;Shang, Zikai
通讯作者:
Chen, Xiqu
作者机构:
[Shang, Zikai; Fang, Chao; Lv, Qiang; Chen, Xiqu] Wuhan Polytech Univ, Sch Elect & Elect Engn, Wuhan, Hubei, Peoples R China.
通讯机构:
[Chen, Xiqu] W
Wuhan Polytech Univ, Sch Elect & Elect Engn, Wuhan, Hubei, Peoples R China.
语种:
英文
关键词:
Bolometers;Focal plane arrays;Focusing;Temperature distribution;Temperature sensors;Infrared response;Infrared responsivity;Microbolometer;Microbolometer arrays;Readout integrated circuits;Responsivity;Substrate temperature;Voltage signals;Substrates
期刊:
Optik
ISSN:
0030-4026
年:
2019
卷:
188
页码:
110-114
基金类别:
This work was supported by China Hubei Provincial Science & Technology Department (ID: 2014CFB882 ).
机构署名:
本校为第一且通讯机构
院系归属:
电气与电子工程学院
摘要:
For a normal microbolometric focal plane array, the microbolometric infrared responsivity varies with its substrate temperature fluctuations because of the semiconductor characteristics of the microbolometer array. The relationship between the microbolometric infrared responsivity and substrate temperature is theoretically discussed in this paper. Above the discussion, a new substrate temperature compensation method is proposed for microbolometric focal plane array without TEC. The microbolometric focal plane array is based on a kind of high-sp...

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