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Study of the Solder Characteristics of IGBT Modules Based on Thermal–Mechanical Coupling Simulation

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成果类型:
期刊论文
作者:
Chen, Jibing;Liu, Bowen;Hu, Maohui;Huang, Shisen;Yu, Shanji;...
通讯作者:
Chen, JB
作者机构:
[Yu, Shanji; Huang, Shisen; Yang, Junsheng; Liu, Bowen; Hu, Maohui; Chen, Jibing] Wuhan Polytech Univ, Sch Mech Engn, Wuhan 430000, Peoples R China.
[Wu, Yiping] Huazhong Univ Sci & Technol, Sch Mat Sci & Engn, Wuhan 430070, Peoples R China.
通讯机构:
[Chen, JB ] W
Wuhan Polytech Univ, Sch Mech Engn, Wuhan 430000, Peoples R China.
语种:
英文
关键词:
IGBT solder layer;interconnection technology;packaging reliability;thermal conductivity characteristics;thermal–mechanical coupling
期刊:
Materials
ISSN:
1996-1944
年:
2023
卷:
16
期:
9
页码:
3504-
基金类别:
Conceptualization, J.C. and B.L.; methodology, J.C.; software, B.L.; validation, J.C., B.L. and M.H.; formal analysis, J.C. and M.H.; investigation, S.H. and S.Y.; resources, B.L. and S.H.; data curation, S.H. and S.Y.; writing—original draft preparation, J.C. and B.L.; writing—review and editing, J.C. and B.L.; visualization, Y.W. and J.Y.; supervision, Y.W. and J.Y.; project administration, Y.W. and J.Y.; funding acquisition, J.C. and J.Y. All authors have read and agreed to the published version of the manuscript. This paper was supported by the Science and Technology Project of Science and Technology Department of Hubei Province (No. 2022EHB020).
机构署名:
本校为第一且通讯机构
院系归属:
机械工程学院
摘要:
The insulated-gate bipolar transistor (IGBT) represents a crucial component within the domain of power semiconductor devices, which finds ubiquitous employment across a range of critical domains, including new energy vehicles, smart grid systems, rail transit, aerospace, etc. The main characteristics of its operating environment are high voltage, large current, and high power density, which can easily cause issues, such as thermal stress, thermal fatigue, and mechanical stress. Therefore, the reliability of IGBT module packaging has become a cr...

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